BestFit: A SPICE-compatible model for efficient, passive, broadband transmission-line analysis of dispersive interconnects

被引:1
|
作者
Woo, A [1 ]
Yioultsis, T [1 ]
Cangellaris, AC [1 ]
机构
[1] Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
关键词
D O I
10.1109/EPEP.2003.1250044
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
BestFit refers to a mathematical methodology used for the direct passive synthesis of SPICE-compatible models of multi-conductor interconnect structures. Given the bandwidth of simulation, the length of the interconnect system, and its per-unit-length, frequency-dependent resistance, inductance, capacitance and conductance matrices, the proposed algorithm synthesizes a compact, multi-port, dispersive, SPICE-compatible model for the interconnect. The resulting model is in terms of a concatenation of a number of non-uniform segments of lumped passive circuit representations of the per-unit-length series impedance and shunt admittance matrices, the lengths of which are obtained as a result of a Pade-Chebyshev approximation of the frequency-dependent input impedance matrix of the multiconductor transmission line system. The synthesized circuit is "optimal" in the sense that highly-accurate responses can be obtained with A number of segments per minimum wavelength barely exceeding the Nyquist limit of 2.
引用
收藏
页码:255 / 258
页数:4
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