Immersion Corrosion of Sn-Ag and Sn-Bi Alloys as Successors to Sn-Pb Alloy with Electronic and Jewelry Applications

被引:12
|
作者
Satizabal, Luz M. [1 ]
Poloni, Erik [2 ]
Bortolozo, Ausdinir D. [2 ]
Osorio, Wislei R. [1 ,2 ]
机构
[1] Univ Estadual Campinas, Sch Technol, BR-13484332 Limeira, SP, Brazil
[2] Univ Estadual Campinas, Res Grp Mfg Adv Mat, Sch Appl Sci FCA, Campus Limeira,1300,Pedro Zaccaria St, BR-13484350 Limeira, SP, Brazil
关键词
gold plating; green alloys; immersion corrosion; lead-free alloys; Sn-Ag alloys; Sn-Bi alloys; LEAD-FREE SOLDERS; ELECTROCHEMICAL CORROSION; MECHANICAL-PROPERTIES; TIN-LEAD; BEHAVIOR; MICROSTRUCTURE; ETHANOL; BOARD; STEEL; ACID;
D O I
10.5006/2039
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A comparative investigation on the degradation in two distinctive corrosive media (NaCl and ethanol) of Sn-2 wt% Ag, Sn-10 wt% Bi, and Sn-22 wt% Pb alloys and the traditional Sn-40 wt% Pb alloys is performed. The deterioration is represented by both weight variation and corrosion rate in both 0.9% NaCl solution and anhydrous ethanol. It is shown that both uncoated and gold-plated samples are more susceptible to deterioration in NaCl than ethanol medium. A mechanical-to-corrosion (M/C) ratio is determined for each examined alloy. Considering the relative weights and costs associated with both M/C ratio and environmentally-friendly aspects, the Sn-Bi alloy is a potential successor for the traditional Sn-Pb alloys.
引用
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页码:1064 / 1080
页数:17
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