Thermal Conductivity Characterization of Thermal Grease Containing Copper Nanopowder

被引：14

作者：

Kang, Haneul ^{[1
]}

Kim, Hyunji ^{[1
]}

An, Jihye ^{[1
]}

Choi, Siyeon ^{[2
]}

Yang, Jinho ^{[3
]}

Jeong, Hyomin ^{[4
]}

Huh, Sunchul ^{[4
]}

机构：

[1] Gyeongsang Natl Univ, Grad Sch, Dept Energy & Mech Engn, Tongyeonghaean Ro 2, Tongyeong Si 53064, South Korea

[2] KOPO Deajeon Si Polytech Campus, Dept Mech Engn Syst, Deajeon Si 34503, South Korea

[3] KOPO Iksan Si Polytech Campus, Dept Comp Aided Machinery, Iksan Si 54567, South Korea

[4] Gyeongsang Natl Univ, Dept Energy & Mech Engn, Tongyeonghaean Ro 2, Tongyeong Si 53064, South Korea

来源：

MATERIALS | 2020年 / 13卷 / 08期

基金：

新加坡国家研究基金会;

关键词：

thermal interface materials; nano powder; thermal grease; thermal conductivity; graphene; alumina; SILICONE-RUBBER; INTERFACE; GRAPHENE; FABRICATION;

D O I：

10.3390/ma13081893

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is a kind of thermal conductive material, with silicon oil. In addition, copper powder was mixed with graphene and alumina, respectively, and the thermal conductivity performance was compared. As a result, the thermal conductivity improved by 4.5 W/m<bold>k over the silicon base</bold>, and the upward trend of thermal conductivity increased steadily up to 15 vol. %, and the increasing trend decreased after 20 vol. %. In addition, the increased rate of thermal conductivity from 0 to 5 vol. % and 10 to 15 vol. % was the largest.

引用

页数：10

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