Applying crystallographic orientation analysis for exploring deformation mechanism of 6.5 wt.% Si electrical strip during twin-roll thin strip casting process

被引:4
|
作者
Hu, W. L. [1 ]
Zhang, Y. X. [1 ]
Yuan, G. [1 ]
Zhang, X. M. [1 ]
Zhao, J. H. [2 ]
Wang, G. D. [1 ]
机构
[1] Northeastern Univ, State Key Lab Rolling & Automat, Shenyang 110819, Peoples R China
[2] Taiyuan Univ Sci & Technol, Minist Educ, Heavy Machinery Engn Res Ctr, Taiyuan 030024, Peoples R China
基金
中国国家自然科学基金;
关键词
Deformation mechanism; Crystallographic orientation; 6.5 wt.% Si electrical strip; Twin-roll thin strip casting process; DUPLEX STAINLESS-STEEL; CARBON-STEELS; TEXTURE; MICROSTRUCTURE; BEHAVIOR; SPECIFICATION; POLYCRYSTALS; STRAIN;
D O I
10.1016/j.jmrt.2021.06.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The study described here is aimed at illuminating deformation mechanism involved in Twin-roll Thin Strip Casting Process (TRSC) with respect to high-permeability 6.5 wt.% Si electrical strip (6.5 wt.% Si strip) in terms of crystal plasticity (CP) theory, and a Visco-plastic Self-consistent model (VPSC) was utilized to explore the deformation mechanism by applying crystallographic orientation (OR) analysis. Results underscore that the acti-vation of overall potential single slip system with regard to studied 6.5 wt.% Si strip including {110} <111>, {112} <111> as well as {123} <111> can contribute to the OR conversion from Cube texture to Rotated-Cube texture, alpha-fiber texture as well as gamma-fiber texture, while with different evolution rate during deformation. The potential multi-slip system of {112} <111> + {123} <111> with average number of activated slip system per grain-9.1-9.4, and multi-slip system of {110} <111> + {112} <111> +{123} <111> with average number of activated slip system per grain similar to 10.4-10.8 are identified to be the predominant slip systems during deformation by comparing to the actual OR features obtained from TRSC-processed 6.5 wt.% Si strip. The CP-based method proposed in present study is deemed as a reference to investigate deformation behavior involved in the other semi-solid forming process. (C) 2021 The Author(s). Published by Elsevier B.V.
引用
收藏
页码:1980 / 1991
页数:12
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