共 50 条
- [21] A Physics-of-failure based Prognostic Method for Power Modules EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1190 - +
- [22] Prediction of reliability on thermoelectric module through accelerated life test and Physics-of-failure Electronic Materials Letters, 2011, 7 : 271 - 275
- [23] A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling Journal of Microelectronics and Electronic Packaging, 2023, 20 (01): : 27 - 35
- [25] Reliability analysis and condition-based maintenance of systems with dependent degrading components based on thermodynamic physics-of-failure The International Journal of Advanced Manufacturing Technology, 2016, 86 : 913 - 923
- [26] Reliability analysis and condition-based maintenance of systems with dependent degrading components based on thermodynamic physics-of-failure INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2016, 86 (1-4): : 913 - 923
- [27] ROLE OF STATISTICAL VIS-A-VIS PHYSICS-OF-FAILURE METHODS IN RELIABILITY ENGINEERING JOURNAL OF RELIABILITY AND STATISTICAL STUDIES, 2009, 2 (01): : 41 - 51
- [28] Physics-of-failure halt result assessment ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 57 - 62
- [29] A Review of Fatigue Mechanism of Power Devices Based on Physics-of-Failure Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2019, 34 (04): : 717 - 727