VLSI: An investigation into the effect of non-uniform distribution of current on crosstalk noise

被引:0
|
作者
Kadim, H. J. [1 ]
机构
[1] LJMU, Sch Engn, Liverpool L3 3AF, Merseyside, England
来源
ELECTRONICS AND COMMUNICATIONS: PROCEEDINGS OF THE 7TH WSEAS INTERNATIONAL CONFERENCE ON ELECTRONICS, HARDWARE, WIRELESS AND OPTICAL COMMUNICATIONS (EHAC '08) | 2008年
关键词
interconnect; crosstalk; noise; distributed RLC;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
On-chip interconnect has become a critical dominant factor affecting the performance and reliability of high performance integrated circuits (IC) such as system-on-a-chip (SoC). As the chip dimensions increase with chip complexity, interconnects tend to get longer. The longer on-chip interconnects coupled with a decrease in wire width and wire separation, inductive effects, and more specifically, mutual inductance coupling between neighbouring wires become non-negligible. An analytical model to examine the effect of non-uniform distribution of current on the mutual inductance and capacitance between on-chip interconnects, and the subsequent effect on the noise peak voltage of the victim line, is presented.
引用
收藏
页码:19 / +
页数:2
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