The role of Zn precipitates and Cl- anions in pitting corrosion of Sn-Zn solder alloys

被引：125
|
作者：
Liu, Jian-Chun [1 ,2 ]
Park, SungWon [1 ]
Nagao, Shijo [1 ]
Nogi, Masaya [1 ]
Koga, Hirotaka [1 ]
Ma, Ju-Sheng [2 ]
Zhang, Gong [2 ]
Suganuma, Katsuaki [1 ]
机构：
[1] Osaka Univ, Inst Sci & Ind Res, Ibaraki, Osaka 5670047, Japan
[2] Tsinghua Univ, Dept Mech Engn, Beijing 100084, Peoples R China
来源：
CORROSION SCIENCE | 2015年 / 92卷
关键词：
Electronic materials; Zinc; EIS; Polarization; SEM; Pitting corrosion; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; NACL AQUEOUS-SOLUTION; LEAD-FREE SOLDERS; PVD COATED STEELS; LOCALIZED CORROSION; POLARIZATION CHARACTERISTICS; HIGH-TEMPERATURE; BINARY-ALLOYS; BEHAVIOR; TIN;
D O I：
10.1016/j.corsci.2014.12.014
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Electrochemical corrosion behavior of Sn-Zn solder alloys in aerated and quiescent 0.5 M NaCl solution was investigated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization techniques, aiming to assess the role of Zn precipitates and Cl- anions in pitting corrosion. The results reveal that increasing in Zn contents leads to increasing in pitting susceptibility, ascribed to the coarsening Zn precipitates with larger intergranular boundaries between Zn-rich precipitates and Sn matrix. The EIS results provide a quantitative description of the electrochemical interface behavior. The mechanism of pitting and the role of Cl- anions are discussed. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码：263 / 271
页数：9
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