Voltage-induced recovery of dielectric breakdown (high current resistance switching) in HfO2

被引:14
|
作者
El Kamel, F. [1 ]
Gonon, P. [2 ]
Vallee, C. [2 ]
Jousseaume, V. [3 ]
Grampeix, H. [3 ]
机构
[1] El Manar Univ, Lab Org & Properties Mat, Tunis 1060, Tunisia
[2] FJoseph Fourier Univ, Microelect Technol Lab, French Natl Res Ctr, F-38054 Grenoble 9, France
[3] CEA LETI MINATEC, F-38054 Grenoble 9, France
关键词
D O I
10.1063/1.3541961
中图分类号
O59 [应用物理学];
学科分类号
摘要
Metal/HfO2/Pt stacks (where the metal is Au, Ag, Co, Ni, Cr, or In) are voltage stressed to induce a high-to-low resistive transition. No current compliance is applied during stressing (except the 100 mA limit of the voltage source). As a consequence very high conductance states are reached after switching, similar to a hard breakdown. Samples conductance after breakdown can reach up to 0.1 S, depending on the metal electrode. Despite the high postbreakdown conductance level, the samples are able to recover an insulating state by further voltage biasing ("high current resistance switching"). (c) 2011 American Institute of Physics. [doi:10.1063/1.3541961]
引用
收藏
页数:3
相关论文
共 50 条
  • [1] Low voltage stress-induced leakage current in HfO2 dielectric films
    Tan, Tingting
    Liu, Zhengtang
    Tian, Hao
    Liu, Wenting
    MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2010, 171 (1-3): : 159 - 161
  • [2] Resistive switching effects of HfO2 high-k dielectric
    Chan, M. Y.
    Zhang, T.
    Ho, V.
    Lee, P. S.
    MICROELECTRONIC ENGINEERING, 2008, 85 (12) : 2420 - 2424
  • [3] Impact of Intrinsic Series Resistance on the Reversible Dielectric Breakdown Kinetics in HfO2 Memristors
    Gonzalez, M. B.
    Maestro-Izquierdo, M.
    Campabadal, F.
    Aldana, S.
    Jimenez-Molinos, F.
    Roldan, J. B.
    2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2020,
  • [4] Charge trapping and stress-induced dielectric breakdown characteristics of HfO2 films
    Zhan, N
    Ng, KL
    Poon, AC
    Wong, H
    Kok, CW
    2003 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, 2003, : 369 - 372
  • [5] A new breakdown failure mechanism in HfO2 gate dielectric
    Ranjan, R
    Pey, KL
    Tang, LJ
    Tung, CH
    Groeseneken, G
    Radhakrishnan, M
    Kaczer, B
    Degraeve, R
    De Gendt, S
    2004 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS, 2004, : 347 - 352
  • [6] Voltage pulse induced resistance change response of ReRAM with HfO2 layer
    Azuma, A.
    Nakajima, R.
    Yoshida, H.
    Shimizu, T.
    Ito, T.
    Shingubara, S.
    NONVOLATILE MEMORIES 6 -AND- SURFACE CHARACTERIZATION AND MANIPULATION FOR ELECTRONIC APPLICATIONS, 2018, 86 (03): : 13 - 21
  • [7] Synapse and resistance switching behavior of La:HfO2/ZrO2/La:HfO2 memristors
    Su, Yong-Jun
    Jiang, Yan-Ping
    Tang, Jia-Yu
    Tang, Xin-Gui
    Tang, Zhenhua
    Guo, Xiao-Bin
    Li, Wen-Hua
    Zhou, Yichun
    INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2025,
  • [8] Time Dependent Dielectric Breakdown and Stress Induced Leakage Current Characteristics of 8Å EOT HfO2 N-MOSFETS
    O'Connor, Robert
    Hughes, Greg
    Kauerauf, Thomas
    Ragnarsson, Lars-Ake
    2010 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2010, : 799 - 803
  • [9] Nanopore fabricated in pyramidal HfO2 film by dielectric breakdown method
    Wang, Yifan
    Chen, Qi
    Deng, Tao
    Liu, Zewen
    APPLIED PHYSICS LETTERS, 2017, 111 (14)
  • [10] HfO2/spacer-interface breakdown in HfO2 high-κ/poly-silicon gate
    Ranjan, R
    Pey, KL
    Tung, CH
    Tang, LJ
    Elattari, B
    Kauerauf, T
    Groeseneken, G
    Degraeve, R
    Ang, DS
    Bera, LK
    MICROELECTRONIC ENGINEERING, 2005, 80 : 370 - 373