FEM Analysis of Nickel Plating and Substrate Separating Process

One thermal shock method without pollution and substrate damage is proposed for separating electroplating nickel plating and substrate. The distributions of the thermal stresses between the nickel plating layer and medium carbon steel substrate were analyzed by finite element method. Thermal shock experiment of electroplated diamond tool was carried out. The analysis results indicate that there existed stress concentrations and stress variation between plating layer and substrate interface during thermal shock operation. Then the bonding strength between plating and substrate became weak. The cracks would occur within the interface after thermal shock operation. Usually, cracks would first occur in the transition region of the interface shape. The finite element analysis results were verified through thermal shock experiment. The separation between nickel plating and tool substrate was observed. Thermal shock method was proved to be a feasible and environment-friendly method to separate plating and substrate.