Electro-mechanical Degradation Model of Flexible Metal Films Due to Fatigue Damage Accumulation

被引：6

作者：

Sun, Bin ^{[1
]}

Huang, Xingzhen ^{[1
]}

Li, Zhaoxia ^{[1
]}

机构：

[1] Southeast Univ, Dept Engn Mech, Jiangsu Key Lab Engn Mech, Nanjing 210096, Peoples R China

来源：

METALS AND MATERIALS INTERNATIONAL | 2020年 / 26卷 / 04期

关键词：

Electro-mechanical; Electrical resistivity; Damage; Fatigue; Metal films; CU THIN-FILMS; CRACK-GROWTH; GOLD-FILMS; BEHAVIOR; DEFORMATION; PROPAGATION; ELECTRONICS; INITIATION; SIMULATION; NUCLEATION;

D O I：

10.1007/s12540-019-00351-x

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An electro-mechanical degradation model is developed to evaluate the electronic and mechanical reliability performance of metal films due to fatigue accumulation. The model establishes the relationship between electrical resistivity and damage, which can be used to predict the change in electrical resistivity and damage evolution of metal films under fatigue loading. Based on the developed model, fatigue damage evolution and change in electrical resistivity simulation of metal films can be implemented to evaluate the electronic and mechanical reliability performance of metal films for the condition where the stress/strain level is heterogeneous. As a case study, fatigue damage evolution and change in electrical resistivity of a copper film on flexible substrate under cyclic loading is numerical analyzed and compared with experiment. It shows that the electro-mechanical degradation model and implemented simulation are effective, and can be used to evaluate the electronic and mechanical reliability performance of metal films due to fatigue accumulation reasonably. Graphic

引用

页码：501 / 509

页数：9

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