A new method of the electromagnetic simulation of 3D microwave integrated circuits

被引:0
|
作者
Ke, YZ [1 ]
Yu, M [1 ]
Chen, J [1 ]
Dai, JF [1 ]
机构
[1] Tianjin Univ, Sch Elect Informat Engn, Tianjin 300072, Peoples R China
关键词
three-dimension microwave integrated circuits (3DMIC); electromagnetic simulation; and theory model;
D O I
暂无
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
A new method of electromagnetic simulation of three-dimension microwave integrated circuits (3DMIC) is proposed in this paper. Combining the theory of complex images with moment method, the model for electromagnetic simulation of 3DMIC is set up. And real 3DMICs are simulated by the software of electromagnetic simulation The results show the model is effective and applied.
引用
收藏
页码:201 / 205
页数:5
相关论文
共 50 条
  • [21] 3D Integrated Circuits Multifactor Placement
    Melikyan, V. Sh.
    Harutyunyan, A. G.
    [J]. 2017 IEEE EAST-WEST DESIGN & TEST SYMPOSIUM (EWDTS), 2017,
  • [22] Placement and routing in 3D integrated circuits
    Ababei, C
    Feng, Y
    Goplen, B
    Mogal, H
    Zhang, TP
    Bazargan, K
    Sapatnekar, S
    [J]. IEEE DESIGN & TEST OF COMPUTERS, 2005, 22 (06): : 520 - 531
  • [23] The Effect of NBTI on 3D Integrated Circuits
    Lin, Cheng-Hong
    Lu, Yi-Chang
    Tang, Chin-Khai
    Tsai, Kuen-Yu
    [J]. 2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 201 - 204
  • [24] Design and CAD for 3D integrated circuits
    Franzon, Paul D.
    Davis, W. Rhett
    Steer, Michael B.
    Lipa, Steve
    Oh, Eun Chu
    Thorolfsson, Thor
    Melamed, Samson
    Luniya, Sonali
    Doxsee, Tad
    Berkeley, Stephen
    Shani, Ben
    Obermiller, Kurt
    [J]. 2008 45TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2, 2008, : 668 - +
  • [25] Manufacturing of 3D Integrated Sensors and Circuits
    Schrems, Martin
    Siegert, Joerg
    Dorfi, Peter
    Kraft, Jochen
    Stueckler, Ewald
    Schrank, Franz
    Selberherr, Siegfried
    [J]. PROCEEDINGS OF THE 2014 44TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2014), 2014, : 162 - 165
  • [26] NEW METHOD OF MODELING ELECTRONIC-CIRCUITS COUPLED WITH 3D ELECTROMAGNETIC FINITE-ELEMENT MODELS
    BRAUER, JR
    MACNEAL, BE
    LARKIN, LA
    OVERBYE, VD
    [J]. IEEE TRANSACTIONS ON MAGNETICS, 1991, 27 (05) : 4085 - 4088
  • [27] A reconfigurable test method based on LFSR for 3D stacking integrated circuits
    Tian, Chen
    Lu, Jianyong
    Jun, Liu
    Liang, Huaguo
    Lu, Yingchun
    Yi, Maoxiang
    [J]. INTEGRATION-THE VLSI JOURNAL, 2022, 87 : 82 - 89
  • [28] Multilayer Reconfigurable 3D Photonics Integrated Circuits Based on Deposition Method
    Xu, Xinru
    Zhang, Daming
    Zhang, Peng
    Tang, Bo
    Yin, Yuexin
    [J]. LASER & PHOTONICS REVIEWS, 2024,
  • [29] Electromagnetic-Circuital-Thermal Co-Simulation for Integrated Circuits and Microwave Applications
    Zhang, Huan Huan
    Liu, Ying
    Sha, Wei E., I
    Ding, Da Zhi
    Fan, Zhen Hong
    [J]. 2019 INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (ISAP 2019), 2019,
  • [30] 3DCoB: A new design approach for Monolithic 3D Integrated Circuits
    Sarhan, Hossam
    Thuries, Sebastien
    Billoint, Olivier
    Clermidy, Fabien
    [J]. 2014 19TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2014, : 79 - 84