Transient Liquid Phase Bonding of Al-2%Nanoclay Composite: Microstructural Characterization and Mechanical Properties

In this research, transient liquid phase (TLP) bonding method was used to join Al-2%Nanoclay composite, using a Cu interlayer. The samples were bonded for 60 to 240 min at 580 degrees C. Microstructural evaluations showed that the bond line was widened by increment in holding time due to dissolution of joint zone and base material. However, bond width decreased in 240-min sample due to the completion of isothermal solidification and subsequent homogenization. Phase assessment revealed CuAl2 precipitates in joint zone. Since the Al base material contained Nanoclay particles, it prevented extensive grain growth after TLP bonding. Mechanical properties tests exhibited that shear strength increased from 60 MPa in 60-min sample to 88 MPa in 180-min sample, owing to advance in homogenization and dissolution following the completion of isothermal solidification.