Transient Liquid Phase Bonding of Al-2%Nanoclay Composite: Microstructural Characterization and Mechanical Properties

被引：0
|
作者：
Gholipour, Vahid [1 ]
Shamanian, Morteza [1 ]
Ghaderi, Sina [1 ]
Maleki, Ali [2 ]
Ashrafi, Ali [1 ]
机构：
[1] Isfahan Univ Technol, Dept Mat Engn, Esfahan 8415683111, Iran
[2] Isfahan Univ Technol, Dept Mech Engn, Esfahan, Iran
来源：
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS | 2021年 / 74卷 / 09期
关键词：
Al composite; Microstructure; Mechanical properties; Nanoclay; Transient liquid phase bonding (TLP); ALUMINUM-MATRIX COMPOSITES; BEHAVIOR; SIZE;
D O I：
10.1007/s12666-021-02323-5
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
In this research, transient liquid phase (TLP) bonding method was used to join Al-2%Nanoclay composite, using a Cu interlayer. The samples were bonded for 60 to 240 min at 580 degrees C. Microstructural evaluations showed that the bond line was widened by increment in holding time due to dissolution of joint zone and base material. However, bond width decreased in 240-min sample due to the completion of isothermal solidification and subsequent homogenization. Phase assessment revealed CuAl2 precipitates in joint zone. Since the Al base material contained Nanoclay particles, it prevented extensive grain growth after TLP bonding. Mechanical properties tests exhibited that shear strength increased from 60 MPa in 60-min sample to 88 MPa in 180-min sample, owing to advance in homogenization and dissolution following the completion of isothermal solidification.
引用
收藏
页码：2285 / 2295
页数：11
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