Ultrasonic evaluation of high-density silicon carbide ceramics

被引:5
|
作者
Brennan, Raymond [1 ]
Haber, Richard [1 ]
Niesz, Dale [1 ]
McCauley, James [2 ]
机构
[1] Rutgers State Univ, Dept Mat Sci & Engn, Piscataway, NJ 08854 USA
[2] USA, Res Lab, Aberdeen Proving Ground, MD 21005 USA
关键词
D O I
10.1111/j.1744-7402.2008.02208.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Nondestructive ultrasound testing has been evaluated as a technique for analyzing isolated bulk defects and microstructural inhomogeneities in silicon carbide (SiC). Three SiC samples of varying thickness, two of which were fabricated by hot pressing and a third that was fabricated by chemical vapor deposition (CVD), were characterized using pulse-echo ultrasound characterization at a frequency of 75 MHz. Point analysis techniques were utilized to measure variations in time-of-flight (TOF), or ultrasound travel time through each sample, for calculation of regional differences in material velocity and elastic properties. C-scan imaging was used to evaluate differences in both TOF and reflected signal amplitude over the area of each sample. Area-under-the-curve (AUTC) and full-width at half-maximum (FWHM) data were obtained from normalized histograms to establish trends for direct sample comparison. It was determined that lower AUTC and FWHM values correlated to higher density samples with fewer inhomogeneities. However, the histogram tail area and distribution were also important features, providing information about specific inhomogeneities and their distributions.
引用
收藏
页码:210 / 218
页数:9
相关论文
共 50 条
  • [31] Ultrasonic characterization of microwave joined silicon carbide/silicon carbide
    House, MB
    Day, PS
    NONDESTRUCTIVE EVALUATION OF CERAMICS, 1998, 89 : 137 - 144
  • [32] Fabrication of porous silicon carbide ceramics with high porosity and high strength
    Chen, Weiwu
    Miyamoto, Yoshinari
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2014, 34 (03) : 837 - 840
  • [33] Porosity of silicon carbide ceramics
    Slutsker, A.I.
    Betekhtin, V.I.
    Sinani, A.B.
    Kadomtsev, A.G.
    Ordanyan, S.S.
    Science of Sintering, 2002, 34 (02) : 143 - 156
  • [34] High-density packaging technologies on silicon substrates
    Akazawa, M
    Kuramochi, S
    Maruyama, T
    Nakayama, K
    Takano, A
    Yamaguchi, M
    Fukuoka, Y
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 647 - 651
  • [35] Study of Silicon Carbide Ceramics
    Abunaemeh, Malek
    Ojo, Ibidapo
    Seif, Mohamed
    Muntele, Claudiu
    Ila, Daryush
    ION BEAMS AND NANO-ENGINEERING, 2010, 1181 : 123 - +
  • [36] Silicon interposer technology for high-density package
    Matsuo, M
    Hayasaka, N
    Okumura, K
    Hosomi, E
    Takubo, C
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1455 - 1459
  • [37] HEMISPHERICAL GRAIN SILICON FOR HIGH-DENSITY DRAMS
    WATANABE, H
    SAKAI, A
    TATSUMI, T
    NIINO, T
    SOLID STATE TECHNOLOGY, 1992, 35 (07) : 29 - 33
  • [38] Emission of silicon clusters by high-density excitation
    Yamamoto, H
    Baba, Y
    SURFACE SCIENCE, 1999, 433 : 890 - 895
  • [39] PREPARATION OF HIGH-DENSITY CERIA-YTTRIA CERAMICS
    DRAGOO, AL
    DOMINGUES, LP
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1982, 65 (05) : 253 - 259
  • [40] High-density ceramics obtained by andesite basalt sintering
    Pavkov, Vladimir
    Bakic, Gordana
    Maksimovic, Vesna
    Cvijovic-Alagic, Ivana
    Prekajski-Dordjevic, Marija
    Bucevac, Dusan
    Matovic, Branko
    PROCESSING AND APPLICATION OF CERAMICS, 2022, 16 (02) : 143 - 152