Sensors and smart electronics in harsh environment applications

Harsh environments are e. g, high temperatures, high pressures, aggressive media, electromagnetic and nuclear radiation. Sometimes, combinations of these adverse conditions may occur. Examples are mines, extruders, gamma -therapy units, airplanes, and nuclear waste stations. In all these cases, the operation of the sensor is vital to the user. Incorporation of a sensor into a system and accessibility can imply the need for remote measurements (combustion engines, torque control in drill shafts). The extension of the application fields from "normal conditions" to harsh environments does not solely affect the choice of new materials but also implies the development of better metallizations, cables, carriers, and cases. The current status of harsh environment sensors and microsystems in view of materials, properties, packaging technologies and realized devices will be reviewed. Possible semiconductor candidates such as silicon carbide or diamond for high temperature applications are being discussed. The main obstacles for the future of high temperature and harsh environment devices and microsystems will be highlighted.