Spur-Less Interdigital Metal-Insulator-Metal Capacitor

被引:0
|
作者
Xie, Na [1 ]
Tie, Huanyan [1 ]
Ma, Qiang [1 ]
Zhou, Bo [1 ]
机构
[1] Nanjing Univ Posts & Telecommun, Coll Elect & Opt Engn, Nanjing, Peoples R China
关键词
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A wideband interdigital metal-insulator-metal (MIM) capacitor is created and built in a two-layer low temperature co-fired ceramic (LTCC) substrate. To reduce the number of stopbands and eliminate unexpected spurs which restrict the bandwidth, short-interconnection that interconnects the open ends of interval fingers is proposed. The increment of bandwidth and capacitance of the proposed interdigital MIM capacitor is 206% and 25%, respectively. The proposed interdigital capacitor has a wider frequency applicational range and a compact size of only 8.2 x 6.2 mm. Performance discussion and comparisons are also carried out.
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页码:49 / 54
页数:6
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