Optimized flip-chip interconnect for 38 GHz thin-film microstrip multichip modules

被引：0

作者：

Huynh, NH ^{[1
]}

Heinrich, W ^{[1
]}

Hirche, K ^{[1
]}

Scholz, W ^{[1
]}

Warth, M ^{[1
]}

Ehrlinger, W ^{[1
]}

机构：

[1] Ferdinand Braun Inst Hochstfrequenztech, Berlin, Germany

来源：

2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2000年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Flip-chip interconnects with 80 mum bumps are optimized for 38 GHz by means of electromagnetic simulation. Thin-film microstrip is used as transmission-line on the carrier substrate. A compensation structure reduces reflections at the interconnect below -20 dB. Measurements of a passive structure and active chip modules proved feasibility of this approach.

引用

页码：69 / 72

页数：4

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