Modelling, simulation and design optimization of rapid thermal processing system

被引：0
|
作者：
Kulkarni, RN [1 ]
Shaligram, AD [1 ]
机构：
[1] Univ Poona, Dept Elect Sci, Poona 411007, Maharashtra, India
来源：
IETE TECHNICAL REVIEW | 1998年 / 15卷 / 1-2期
关键词：
D O I：
10.1080/02564602.1998.11416739
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes modelling and simulation of rapid thermal processor, Further, these modelling and simulation experiments have been used to design and optimize the rapid thermal processing chamber dimension. Using these design guidelines, a Rapid Thermal Processor (RTP), reaching 1200 degrees C with a ramp rate 200 degrees C/second has been fabricated. Likewise, RTP chamber for any specifications can be designed. The results of these experiments are illustrated.
引用
收藏
页码：123 / 129
页数：7
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