Real-Time Monitoring of Aluminum Crevice Corrosion and Its Inhibition by Vanadates with Multiple Beam Interferometry in a Surface Forces Apparatus

Crevice corrosion (CC) of metals remains a serious concern for structural materials. Yet a real-time in situ visualization of corrosion, and its inhibition within a confined geometry, remains challenging. Here, we present how multiple-beam interferometry in a Surface Forces Apparatus can be utilized to directly visualize corrosion processes in real-time and with Angstrom resolution within well-defined confinement geometries. We use atomically smooth muscovite mica surfaces to form round-shaped similar to 1000 mu m(2) crevices on aluminum. After exposure to NaCl solutions we can detect and track active sites of aluminum corrosion within this confined geometry. CC of aluminum randomly initiates in the confined crevice mouth, where the distance between apposing surfaces is between 20-300 nm. We can directly track oxide dissolution/formation, and corrosion-rates as well as their retardation due to sodium vanadate inhibitors present in solution. Formation of a compacted oxide layer effectively inhibits CC in 5 mM NaCl solutions with 2.5 mM of added NaVO3, while inhibition rapidly breaks down at chloride concentrations above 50 mM. Breakdown of the inhibition-layers is initiated by rapid dissolution of the protective oxide within the confined zone. Our technique may be adapted for monitoring CC, corrosion inside of crack-tips, and evaluation of inhibitor efficiencies in a variety of metals. (C) The Author(s) 2015. Published by ECS. This is an open access article distributed 'under the terms of the Creative Commons Attribution Non-Commercial No Derivatives 4.0 License (CC BY-NC-ND, http://creativecommons.org/licenses/by-nc-nd/4.0/), which permits non-commercial reuse, distribution, and reproduction in any medium, provided the original work is not changed in any way and is properly cited. For permission for commercial reuse, please email: oa@electrochem.org. All rights reserved.