Extracting Model Parameters from Thermal Transient Measurements for Thermal Stress Simulation

被引:0
|
作者
Sarkany, Zoltan [1 ]
Rencz, Marta [1 ]
机构
[1] Budapest Univ Technol & Econ, Budapest, Hungary
来源
2014 20TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2014) | 2014年
关键词
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
In this article it is presented how structural information and temperature distribution can be calculated from thermal transient measurement results. We show how the temperature distribution can be approximated from a time domain temperature transient using simple calculations and that not only the temperatures but the geometry of a three dimensional model can also be calculated from the thermal RC network. The identification method is demonstrated using the measurement results of a simple package structure and the source and magnitude of uncertainties are also investigated.
引用
收藏
页数:5
相关论文
共 50 条
  • [41] THERMAL-TRANSIENT EFFECTS ON PRESSURE MEASUREMENTS
    CHAN, CK
    SIMPSON, ME
    EXPERIMENTAL MECHANICS, 1979, 19 (09) : 324 - 330
  • [42] Measurements of transient thermal impedance of SiC BJT
    Szelagowska, Joanna
    Bisewski, Damian
    Zarebski, Janusz
    PRZEGLAD ELEKTROTECHNICZNY, 2020, 96 (02): : 178 - 181
  • [43] Package Hermeticity Testing With Thermal Transient Measurements
    Vass-Varnai, Andras
    Rencz, Marta
    DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2008, : 24 - 27
  • [44] Evaluation of short pulse thermal transient measurements
    Szekely, V.
    14TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATION OF ICS AND SYSTEMS, 2008, : 20 - 25
  • [45] Application of Infrared Thermography to Thermal Transient Measurements
    Ziegeler, Nils J.
    Nolte, Peter W.
    Schweizer, Stefan
    2019 25TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC 2019), 2019,
  • [46] TRANSIENT THERMAL RESPONSE MEASUREMENTS OF POWER TRANSISTORS
    BLACKBURN, DL
    OETTINGER, FF
    IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS AND CONTROL INSTRUMENTATION, 1975, IE22 (02): : 134 - 141
  • [47] Package hermeticity testing with thermal transient measurements
    András Vass-Várnai
    Márta Rencz
    Microsystem Technologies, 2009, 15 : 1303 - 1309
  • [48] Extracting the Mechanical Properties of Microtubules from Thermal Fluctuation Measurements on an Attached Tracer Particle
    Taute, Katja M.
    Pampaloni, Francesco
    Florin, Ernst-Ludwig
    MICROTUBULES, IN VITRO: MICROTUBULES, IN VITRO, 2010, 95 : 601 - 615
  • [49] High speed IGBT module transient thermal response measurements for model validation
    Berning, D
    Reichl, J
    Heffner, A
    Hernandez, M
    Ellenwood, C
    Lai, JS
    2003 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-3: CROSSROADS TO INNOVATIONS, 2003, : 1826 - 1832
  • [50] The guarded torus: Numerical model of a novel transient method for thermal conductivity measurements
    Seiferlin, Karsten
    MEASUREMENT SCIENCE AND TECHNOLOGY, 2006, 17 (11) : 3083 - 3093