Comparison of failure mechanisms between rubber-modified and unmodified epoxy adhesives under mode II loading condition

被引:8
|
作者
Imanaka, Makoto [1 ]
Orita, Ryousuke [1 ]
Nakamura, Yosinobu [2 ]
Kimoto, Masaki [3 ]
机构
[1] Osaka Univ Educ, Dept Technol Educ, Osaka 582582, Japan
[2] Osaka Inst Technol, Dept Appl Chem, Osaka 5358585, Japan
[3] Tech Res Inst Osaka Prefecture, Dept Chem & Environm, Osaka 5941157, Japan
关键词
D O I
10.1007/s10853-008-2557-6
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The effect of rubber modification on fracture toughness of adhesive joints under mode II loading condition was investigated in comparison with that under mode I loading, wherein the two adhesives rubber-modified and unmodified were used. To evaluate the fracture toughness on the basis of R-curve characteristics under mode II loading condition, four-point bend tests had been conducted for the adhesively bonded end-notched flexure (ENF) specimens. Thus obtained R-curves revealed the following trend: its behavior did not appear for the unmodified adhesive, whereas the rubber-modified adhesive exhibited a typical behavior. In the initial stage of crack propagation, G(IIC) of the rubber-modified adhesive is lower than that of the unmodified adhesive, but becomes greater in the range of Delta a > 25 mm. Nevertheless, the significant improvement of the fracture toughness with the rubber modification under mode I loading condition was not observed under mode II loading. Moreover, FEM analysis was made to elucidate the relation between the above fracture behavior and stress distributions near the crack tip. The results gave the reasonable relationship between evolution of plastic zone and the area with high void-fraction as well as the R-curves behavior. In addition, macroscopic and SEM observations for the fracture surfaces were also conducted.
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收藏
页码:3223 / 3233
页数:11
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