Work-in-Progress: Towards a fine-grain thermal model for uniform multi-core processors

被引：3
|
作者：
Rodriguez, Javier Perez [1 ]
Yomsi, Patrick Meumeu [1 ]
机构：
[1] Polytech Inst Porto, ISEP, CISTER Res Ctr, Porto, Portugal
来源：
2020 IEEE 41ST REAL-TIME SYSTEMS SYMPOSIUM (RTSS) | 2020年
基金：
欧盟地平线“2020”;
关键词：
D O I：
10.1109/RTSS49844.2020.00049
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
On-chip power dissipation is recognized as one of the primary limiters, if not a show stopper, of performance for high-end safety-critical uniform multi-core processors. This paper proposes an efficient and simple thermal model for such a platform to be coupled with the large variety of schedulers designed to control the processor activity and the triggering of the cooling mechanism with as little impact on performance as possible.
引用
收藏
页码：403 / 406
页数：4
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