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- [2] Orthotropic Stress Field Induced by TSV and Its Impact on Device Performance 2011 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE AND MATERIALS FOR ADVANCED METALLIZATION (IITC/MAM), 2011,
- [3] A Study of Wiggling AA modeling and Its Impact on the Device Performance in Advanced DRAM 2020 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD 2020), 2020, : 101 - 104
- [5] Quantifying the Effect of Nanofeature Size on the Electrical Performance of Black Silicon Emitter by Nanoscale Modeling IEEE JOURNAL OF PHOTOVOLTAICS, 2022, 12 (03): : 744 - 753
- [6] Modeling the impact of packaging stress on device performance Materials, Technology and Reliability of Advanced Interconnects-2005, 2005, 863 : 339 - 344
- [10] Discrete distribution of implanted and annealed arsenic atoms in silicon nanowires and its effect on device performance Nanoscale Research Letters, 7