Synthesis and anti-bacterial activity of Cu, Ag and Cu-Ag alloy nanoparticles: A green approach

被引:291
|
作者
Valodkar, Mayur [1 ]
Modi, Shefaly [1 ]
Pal, Angshuman [1 ]
Thakore, Sonal [1 ]
机构
[1] Maharaja Sayajirao Univ Baroda, Fac Sci, Dept Chem, Vadodara 390002, Gujarat, India
关键词
Nanostructures; Alloys; Electron microscopy; Optical properties; MICROWAVE-ASSISTED SYNTHESIS; SILVER NANOPARTICLES; AU-AG; ANTIMICROBIAL ACTIVITY; SHELL NANOPARTICLES; GOLD; COPPER; POLYMER; AGENT;
D O I
10.1016/j.materresbull.2010.12.001
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Metallic and bimetallic nanoparticles of copper and silver in various proportions were prepared by microwave assisted chemical reduction in aqueous medium using the biopolymer, starch as a stabilizing agent. Ascorbic acid was used as the reducing agent. The silver and copper nanoparticles exhibited surface plasmon absorption resonance maxima (SPR) at 416 and 584 nm, respectively; while SPR for the Cu-Ag alloys appeared in between depending on the alloy composition. The SPR maxima for bimetallic nanoparticles changes linearly with increasing copper content in the alloy. Transmission electron micrograph (TEM) showed monodispersed particles in the range of 20 +/- 5 nm size. Both silver and copper nanoparticles exhibited emission band at 485 and 645 nm, respectively. The starch-stabilized nanoparticles exhibited interesting antibacterial activity with both gram positive and gram negative bacteria at micromolar concentrations. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:384 / 389
页数:6
相关论文
共 50 条
  • [31] THE ENVIRONMENTALLY ASSISTED FAILURE OF A CU-AG ALLOY IN AN AMINE ENVIRONMENT
    SORENSEN, NR
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (08) : C303 - C303
  • [32] Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn
    Yang, Teng-Kai
    Lin, Chih-Fan
    Chen, Chih-Ming
    JOURNAL OF ELECTRONIC MATERIALS, 2015, 44 (01) : 511 - 517
  • [33] Precipitate strengthening of Cu-Ag alloy in situ filamentary composites
    Ning Yuantao
    Zhang Xiaohui
    Yuejun, Wu
    RARE METAL MATERIALS AND ENGINEERING, 2007, 36 (10) : 1807 - 1810
  • [34] Surface tension and density of Cu-Ag, Cu-In and Ag-In alloys
    Kucharski, M.
    Fima, P.
    Skrzyniarz, P.
    Przebinda-Stefanowa, W.
    ARCHIVES OF METALLURGY AND MATERIALS, 2006, 51 (03) : 389 - 397
  • [35] Effect of an applied stress on discontinuous precipitation in a Cu-Ag alloy
    Monzen, R.
    Terazawa, T.
    Watanabe, C.
    15TH INTERNATIONAL CONFERENCE ON THE STRENGTH OF MATERIALS (ICSMA-15), 2010, 240
  • [36] Deposition of Cu-Ag alloy film by supercritical fluid deposition
    Zhao, Bin
    Momose, Takeshi
    Shimogaki, Yukihiro
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2006, 45 (46-50): : L1296 - L1299
  • [37] Fabrication of conductive interconnects by Ag migration in Cu-Ag core-shell nanoparticles
    Kim, Suk Jun
    Stach, Eric A.
    Handwerker, Carol A.
    APPLIED PHYSICS LETTERS, 2010, 96 (14)
  • [38] Heterogeneous to homogeneous Cu-Ag nanoparticles by laser reduction in liquid
    Nag, Ashis
    Nguyen, Christopher M.
    Tibbetts, Katharine Moore
    APPLIED SURFACE SCIENCE, 2023, 610
  • [39] Effect of thermal stability on the sintering of Cu-Ag bimetallic nanoparticles
    Cao, Haoyu
    Yan, Quanhe
    Zhang, Zifa
    Kang, Jiaxing
    Liu, Jinkun
    Zhu, Yan
    Xu, Fei
    Meng, Weiwei
    Hong, Feng
    MRS COMMUNICATIONS, 2025, 15 (01) : 105 - 111
  • [40] Energetics of the formation of Cu-Ag core-shell nanoparticles
    Chandross, Michael
    MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2014, 22 (07)