HTS Pancake Coils Without Turn-to-Turn Insulation

被引：0

作者：

Hahn, Seungyong ^{[1
]}

Park, Dong Keun ^{[1
]}

Bascunan, Juan ^{[1
]}

Iwasa, Yukikazu ^{[1
]}

机构：

[1] MIT, Francis Bitter Magnet Lab, Cambridge, MA 02139 USA

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2011年 / 21卷 / 03期

关键词：

HTS pancake coils; mechanical integrity; no-insulation winding; thermal stability; turn-to-turn-insulation;

D O I：

10.1109/TASC.2010.2093492

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports a study of HTS pancake coils without turn-to-turn insulation. Three no-insulation (NI) pancake coils were wound: each single and double pancake coil of Bi2223 conductor and one single pancake of ReBCO conductor. An equivalent electrical circuit for modeling NI coils was verified by two sets of test: 1) charge-discharge; and 2) sudden discharge. Also, an overcurrent test in which a current exceeding a coil's critical current by 2.3 times was performed, and analysed, to demonstrate that in terms of stability NI HTS coils outperform their counterparts. The new NI winding offers HTS coils enhanced performance in three key parameters: overall current density; thermal stability; and mechanical integrity.

引用

页码：1592 / 1595

页数：4

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