Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints

In this investigation on the formation of multiple-layered Kirkendall voids at Cu/Sn-3.5Ag solder joints, Sn-3.5Ag solder balls were reacted with Cu under bump metallurgy (UBM), which was electroplated using bis-sodium sulfopropyl-disulfide, C6H12O6S4Na2 (SPS) additive. The sequence of multilayer Kirkendall voids and Cu-Sn IMC (intermetallic compounds) formations are explained with the aid of cross-sectional scanning electron microscopy (SEM) micrographs and schematic diagrams. During the aging treatment at 150 degrees C, layers of Cu6Sn5/Cu3Sn formed at the solder joints and Kirkendall voids nucleated at the Cu3Sn/Cu interface as a result of the segregation of residual S originating from SPS. However, with Kirkendall void growth, the net section area of the Cu/Cu3Sn interface decreased and the Cu flux into Cu3Sn was inhibited. As the atomic ratio of Cu against Sn in the Cu3Sn dropped, transformation of Cu3Sn into Cu6Sn5 ensued. Subsequent diffusion of Sn atoms into the remaining Cu UBM through the remaining ligament of the Cu6Sn5/Cu interface precipitated secondary Cu3Sn beneath the primary Cu3Sn/Cu interface, and the secondary Kirkendall voids formed at the new Cu3Sn/Cu interface and so on.