Receive and Transmit Beamforming SiGe BiCMOS ICs for Scalable E-Band Phased Arrays

被引:0
|
作者
Varonen, Mikko [1 ]
Lamminen, Antti [1 ]
Kantanen, Mikko [1 ]
Holmberg, Jan [1 ]
Rantala, Arto [1 ]
Lahdes, Manu [1 ]
Saily, Jussi [1 ]
Parveg, Dristy [1 ]
Kaunisto, Mikko [1 ]
Aurinsalo, Jouko [1 ]
机构
[1] VTT Tech Res Ctr Finland Ltd, Espoo, Finland
基金
芬兰科学院;
关键词
beamforming; flip-chip; monolithic microwave integrated circuit (MMIC); phased arrays; vector modulators;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
this paper presents E-band 4 and 16 element receive (RX) and transmit (TX) phase shifter ICs for a scalable RF beamforming architecture. The chips are fabricated in an 0.13-mu m SiGe BiCMOS technology. The TX/RX vector-modulator based phase shifters have an 8-bit resolution. Based on on-wafer measurements at 75 GHz, the 4-element RX phased-array chip achieves a single channel measured maximum gain of 18 dB for the 0 to 360 degree phase range with a simulated noise figure of around 10 dB. The 4-element TX has a single channel measured maximum gain of 16 dB for the full phase range including an on-chip power divider with a simulated 1-dB output compression point of -0.5 dBm. The 16-channel beamforming chips are based on the 4-channel sub-arrays with on-chip power splitting/combining. The power consumption for a single RX and TX phase shifter channel is 115 and 142 mW, respectively.
引用
收藏
页码:273 / 276
页数:4
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