Extreme heat fluxes and heat transfer mechanisms during electronics spray and jet impingement cooling with boiling

Microelectronics already needs for heat removal more than 1 kW/cm(2). To assess the spray cooling capabilities to meet the growing requirements, a review of experimental studies is presented. Both the lack of progress in increasing the limit values of critical heat fluxes over the past 20-30 years and the fact that this technique is considered effective and promising are demonstrated. The "modern" physical picture has been formed at the turn of the 21st century. The review shows that the trend towards increasing the heat transfer coefficients is realized in the same way as in other promising cooling technologies. The paper refers to the studies in which the coolant film thickness was reduced by the authors, as well as those that presented correlations of the three-phase contact line dynamics with the values of the achieved heat flux. A problem is formulated for the required detailed studies of highly dynamic processes in an ultra-thin liquid film at the micro level, aimed at the heat transfer enhancement.