Characterization of a Jet Impingement Heat Sink for Power Electronics Cooling

被引:19
|
作者
Klinkhamer C. [1 ]
Abishek S. [1 ]
Iyer K.L.V. [3 ]
Balachandar R. [1 ,2 ]
Barron R. [1 ]
机构
[1] Department of Mechanical, Automotive and Materials Engineering, University of Windsor, 401 Sunset Ave., ON
[2] Department of Civil and Environmental Engineering, University of Windsor, 401 Sunset Ave., ON
[3] Magna International Inc., Troy, MI
关键词
Computational fluid dynamics; Experimental techniques; Heat transfer; Jet impingement array; Power electronics; Pressure drop;
D O I
10.1016/j.tsep.2022.101408
中图分类号
学科分类号
摘要
Ongoing demand to improve power electronic converters in terms of efficiency, power density, reliability, cost and packaging calls for optimal thermal management. This paper investigates the effectiveness of a jet impingement heat sink consisting of an array of jets impinging discrete heat sources. A mixture of 60 – 40% (by volume) ethylene glycol – water is the coolant used. Through computational simulations and experimentation on a laboratory prototype, the heat transfer and pressure drop of the heat sink is characterized in terms of Reynolds number, Prandtl number, stand-off distance and jet-to-jet spacing. Correlations for area averaged Nusselt numbers and the Euler number are presented. A trade-off between heat transfer and pressure drop performance is further studied. Higher heat transfer rates were obtained with smaller stand-off distances and larger jet-to-jet spacings at the cost of higher pressure drop. Over the range of parameters tested, heat transfer was found to be more sensitive to design changes (maximum variation of 17.3%) compared to pressure drop (<1% variation). An optimal design will consist of a low stand-off distance as this will provide maximum convective heat transfer rates at the cost of minor pressure drop increases and will ensure the heat sink is compact. © 2022 Elsevier Ltd
引用
收藏
相关论文
共 50 条
  • [1] Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review
    Klinkhamer, Corey
    Iyer, K. Lakshmi Varaha
    Etemadi, Majed
    Balachandar, Ram
    Barron, Ron
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13 (06): : 765 - 787
  • [2] Modelling of Jet-Impingement Cooling for Power Electronics
    Rizvi, M. J.
    Skuriat, R.
    Tilford, T.
    Bailey, C.
    Johnson, C. M.
    Lu, H.
    EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, : 107 - +
  • [3] Influence on Cooling Performance of Jet Impingement Heat Sink Structures
    Nakahama, Takafumi
    Tai, Hirimochi
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (05): : 818 - 825
  • [4] Thermal Characterization of a Copper Microchannel Heat Sink for Power Electronics Cooling
    Singh, Randeep
    Akbarzadeh, Aliakbar
    Mochizuki, Masataka
    Nguyen, Thang
    Nguyen, Tien
    JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 2009, 23 (02) : 371 - 380
  • [5] Investigation on heat transfer in a micro-jet impingement cooling heat sink
    College of Environment and Energy Engineering, Beijing University of Technology, Beijing 100022, China
    Kung Cheng Je Wu Li Hsueh Pao, 2007, 3 (448-450):
  • [6] Two-Phase Jet Impingement Heat Sink Integrated with a Compact Vapor Compression System for Electronics Cooling
    de Oliveira, Pablo A.
    Barbosa, Jader R., Jr.
    2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, : 976 - 986
  • [7] Numerical simulations of boiling jet impingement cooling in power electronics
    Narumanchi, Sreekant
    Troshko, Andrey
    Hassani, Vahab
    Bharathan, Desikan
    2006 PROCEEDINGS 10TH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONICS SYSTEMS, VOLS 1 AND 2, 2006, : 204 - +
  • [8] Micro jet array heat sink for power electronics
    Stefanescu, S
    Mehregany, M
    Leland, J
    Yerkes, K
    MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 1999, : 165 - 170
  • [9] Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
    de Oliveira, Pablo A.
    Barbosa, Jader R., Jr.
    JOURNAL OF ELECTRONIC PACKAGING, 2017, 139 (03)
  • [10] Effect of phase change material in cross flow and jet impingement cooling techniques used in heat sink for electronics application
    Parthipan, Deerajkumar
    Dharmalingam, Babu
    Sankaran, Somasundharam
    Rajagopal, Deepakkumar
    NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 2024,