3-D micro coaxial transmission lines with integrated MEM capacitors

被引：7
|
作者：
Natarajan, Saravana P. [1 ]
Weller, Thomas M. [1 ]
Hoff, Andrew M. [1 ]
机构：
[1] Univ S Florida, Dept Elect Engn, Ctr Wireless & Microwave Informat Syst, Tampa, FL 33620 USA
来源：
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2007年 / 17卷 / 12期
关键词：
micro coax capacitor; micro electromechanical (MEM) capacitor; rectangular coax; variable capacitor;
D O I：
10.1109/LMWC.2007.910487
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper introduces a 20 pm-tall, rectangular micro coaxial transmission line with an embedded micro electromechanical (MEM) capacitor. The measured capacitance ratio is about 6.5 with an actuation voltage of 30-50 V. To the best of the authors' knowledge, this is the first time a MEM device has been implemented within a fully-shielded, micro coaxial transmission line structure. The fabrication includes a single step release process for a dual layer suspended structure (beam and the top lid).
引用
收藏
页码：858 / 860
页数：3
相关论文
共 50 条
  • [41] Calculation of 3-D Ion-Flow Field at the Crossing of HVdc Transmission Lines by Method of Characteristics
    Xiao, Fengnyu
    Zhang, Bo
    Mo, Jianghua
    He, Jinliang
    IEEE TRANSACTIONS ON POWER DELIVERY, 2018, 33 (04) : 1611 - 1619
  • [42] 3D Chip Stack with Integrated Decoupling Capacitors
    Dang, Bing
    Wright, Steven L.
    Andry, Paul
    Sprogis, Edmund
    Ketkar, Supriya
    Tsang, Cornelia
    Polastre, Robert
    Knickerbocker, John
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 1 - +
  • [43] 3-D Square Coaxial Waveguide FSS and Equivalent Circuit Model
    Ge, Jinqun
    Zhu, Jianping
    Zhang, Haiyong
    Zhuang, Wei
    Tang, Wanchun
    2016 PROGRESS IN ELECTROMAGNETICS RESEARCH SYMPOSIUM (PIERS), 2016, : 1110 - 1114
  • [44] Miniaturized 3-D Solenoid-Type Micro-Heaters in Coordination With 3-D Microfluidics
    Bian, Hao
    Shan, Chao
    Chen, Feng
    Yang, Qing
    Li, Yanyang
    Li, Qichao
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2017, 26 (03) : 588 - 592
  • [45] 3-D modeling of interconnects in mmics by the method of lines
    Vietzorreck, L
    Pregla, R
    1996 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 1996, : 347 - 350
  • [46] DETECTING 3-D PARALLEL LINES FOR PERCEPTUAL ORGANIZATION
    LEBEGUE, X
    AGGARWAL, JK
    LECTURE NOTES IN COMPUTER SCIENCE, 1992, 588 : 720 - 724
  • [47] An Optical Fiber Probe for 3-D Micro Metrology
    Murakami, Hiroshi
    Katsuki, Akio
    Onikura, Hiromichi
    Sajima, Takao
    Kawagoishi, Norio
    Kondo, Eiji
    Honda, Tomohiro
    ADVANCED PRECISION ENGINEERING, 2010, 447-448 : 524 - +
  • [48] THE 3-DIMENSIONAL (3-D) TRANSMISSION CROSS-COEFFICIENT FOR TRANSMISSION IMAGING
    SHEPPARD, CJR
    GU, M
    OPTIK, 1995, 100 (04): : 155 - 158
  • [49] Sound transmission prediction by 3-D elasticity theory
    Huang, Changzheng
    Nutt, Steven
    APPLIED ACOUSTICS, 2009, 70 (05) : 730 - 736
  • [50] TRANSMISSION OF 3-D IMAGES BY MEANS OF LENS GUIDES
    DUGUAY, MA
    AUMILLER, GD
    APPLIED OPTICS, 1979, 18 (12): : 2081 - 2084
12345