Evaluation of the Effect of Stress Relief Slots on QFN Strip Warpage using Finite Element Analysis

被引：0
|
作者：
Cheng, Xiyun [1 ]
Tan, Lin [1 ]
Wang, Qian [1 ]
Cai, Jian [1 ,2 ]
Wang, Honghui [3 ]
Wang, Xiaojiang [3 ]
Zhang, Tonglong [3 ]
Wang, Shuidi [1 ]
Li, Jinrui [1 ]
机构：
[1] Tsinghua Univ, Inst Microelect, Beijing 100084, Peoples R China
[2] Tsinghua Natl Lab Informat Sci & Technol, Beijing 100084, Peoples R China
[3] Nantong Fujitsu Microelect Co Ltd, Nantong 226006, Jiangsu, Peoples R China
来源：
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年
关键词：
QFN; EMC; Stress Relief Slot; Warpage; Finite Element Analysis;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages. Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced by molding process was simulated using finite element analysis (FEA). Effect of stress relief slots design of the leadframe was evaluated, and the influence of material properties was also studied with three different types of EMC (Epoxy Molding Compound). Simulation results indicated that CTE of the EMC had a considerable effect on the warpage direction and magnitude, and the existence of stress relief slots only slightly reduced warpage magnitude.
引用
收藏
页码：544 / +
页数：2
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