Introduction to the Special Issue on the 2019 IEEE European Solid-State Circuits Conference (ESSCIRC)

被引：0

作者：

Lu, Ping ^{[1
]}

Anders, Jens ^{[2
]}

Gielen, Georges ^{[3
]}

Klumperink, Eric ^{[4
]}

Tavernier, Filip ^{[3
]}

Henderson, Robert ^{[5
]}

Gemmeke, Tobias ^{[6
]}

Shor, Joseph ^{[7
]}

机构：

[1] Microsoft, Silicon & Sensors Dev, Redmond, WA 98052 USA

[2] Univ Stuttgart, Inst Smart Sensors, D-70569 Stuttgart, Germany

[3] Katholieke Univ Leuven, Dept Elect Engn, B-3000 Leuven, Belgium

[4] Univ Twente, NL-7522 NB Enschede, Netherlands

[5] Univ Edinburgh, Sch Engn, Edinburgh EH9 3JF, Midlothian, Scotland

[6] Rhein Westfal TH Aachen, Fac Elect Engn & Informat Technol, D-52062 Aachen, Germany

[7] Bar Ilan Univ, Fac Engn, IL-5290002 Ramat Gan, Israel

来源：

IEEE SOLID-STATE CIRCUITS LETTERS | 2019年 / 2卷 / 09期

关键词：

D O I：

10.1109/LSSC.2019.2944716

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：61 / 62

页数：2

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