Introduction to the Special Issue on the 38th European Solid-State Circuits Conference (ESSCIRC)
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Liscidini, Antonio
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Univ Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON M5S 3G4, CanadaUniv Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada
Liscidini, Antonio
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Smith, Douglas
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Univ Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON M5S 3G4, CanadaUniv Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada
Smith, Douglas
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[1] Univ Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada
The July 2013 Special Issue of IEEE Journal Of Solid-State Circuits presents papers from the 38th European Solid-State Circuits Conference (ESSCIRC). In the first paper, Meyvaert and co-researchers present a fully integrated 265 input AC-DC interface in 0.35 μm CMOS technology, requiring only one optional external low voltage SMD capacitor for improved performance and capable of directly interfacing the universal line voltage and outputting a regulated DC voltage of 3.3 V. The next paper, by Masuch and colleagues present an RF energy harvester embedded in a low-power transceiver front-end in 130 nm CMOS. Lee and Verma present a paper demonstrating a low-power processor with configurable embedded machine-learning accelerators for high-order and adaptive analysis of medical-sensor signals. Carballido and researchers present a portable a flexible and portable digital framework for Built-in Self-Test (BIST) and calibration of RF/analog circuitry.
机构:
Univ Bordeaux, IC Design Team IMS, Microelect Res Lab, Bordeaux, France
Univ Bordeaux, ENSEIRB MATMECA, EE Dept, Bordeaux, FranceUniv Bordeaux, IC Design Team IMS, Microelect Res Lab, Bordeaux, France
Deval, Yann
Rusu, Stefan
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Intel Corp, Santa Clara, CA USAUniv Bordeaux, IC Design Team IMS, Microelect Res Lab, Bordeaux, France