Special Issue Featuring Papers from the International Thermal Spray Conference (ITSC) 2019

被引：1

作者：

McDonald, Andre ^{[1
]}

Azarmi, Fardad ^{[2
]}

Balani, Kantesh ^{[3
]}

Cizek, Jan ^{[4
]}

Koivuluoto, Heli ^{[5
]}

Lau, Yuk-Chiu ^{[6
]}

Li, Hua ^{[7
]}

Toma, Filofteia-Laura ^{[8
]}

机构：

[1] Univ Alberta, Edmonton, AB, Canada

[2] North Dakota State Univ, Fargo, ND 58105 USA

[3] Indian Inst Technol Kanpur, Kanpur, Uttar Pradesh, India

[4] Czech Acad Sci, Inst Plasma Phys, Prague, Czech Republic

[5] Tampere Univ Technol, Tampere, Finland

[6] GE Power & Water, Schenectady, NY USA

[7] Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo, Zhejiang, Peoples R China

[8] Fraunhofer Inst IWS, Dresden, Germany

来源：

JOURNAL OF THERMAL SPRAY TECHNOLOGY | 2020年 / 29卷 / 1-2期

关键词：

D O I：

10.1007/s11666-019-00975-w

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1 / 2

页数：2

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