Mid-infrared type-II InAs/InAsSb quantum wells integrated on silicon

被引:14
|
作者
Delli, E. [1 ]
Hodgson, P. D. [2 ]
Bentley, M. [1 ]
Repiso, E. [2 ]
Craig, A. P. [2 ]
Lu, Q. [2 ]
Beanland, R. [3 ]
Marshall, A. R. J. [2 ]
Krier, A. [2 ]
Carrington, P. J. [1 ]
机构
[1] Univ Lancaster, Dept Engn, Lancaster LA1 4YW, England
[2] Univ Lancaster, Dept Phys, Lancaster LA1 4YB, England
[3] Univ Warwick, Dept Phys, Gibber Hill Rd, Coventry CV4 7AL, W Midlands, England
基金
英国工程与自然科学研究理事会;
关键词
MOLECULAR-BEAM EPITAXY; PLANAR DEFECTS; SI; INAS; GAAS; PHOTODETECTOR; MECHANISM; GROWTH;
D O I
10.1063/5.0022235
中图分类号
O59 [应用物理学];
学科分类号
摘要
Direct integration of III-V semiconductor light sources on silicon is an essential step toward the development of portable, on-chip infrared sensor systems. Driven by the presence of characteristic molecular fingerprints in the mid-infrared (MIR) spectral region, such systems may have a wide range of applications in infrared imaging, gas sensing, and medical diagnostics. This paper reports on the integration of an InAs virtual substrate and high crystalline quality InAs/InAsSb multi-quantum wells on Si using a three-stage InAs/GaSb/Si buffer layer. It is shown that the InAs/GaSb interface demonstrates a strong dislocation filtering effect. A series of strained AlSb/InAs dislocation filter superlattices was also used, resulting in a low surface dislocation density of approximately 4x10(7)cm(-2). The InAs/InAsSb wells exhibited a strong photoluminescence signal at elevated temperatures. Analysis of these results indicates that radiative recombination is the dominant recombination mechanism, making this structure promising for fabricating MIR Si-based sensor systems.
引用
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页数:5
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