Fabrication of functional electromechanical nanowire resonators by focused ion beam implantation

被引:10
|
作者
Llobet, Jordi [1 ]
Gerboles, Marta [1 ]
Sansa, Marc [1 ]
Bausells, Joan [1 ]
Borrise, Xavier [2 ]
Perez-Murano, Francesc [1 ]
机构
[1] Inst Microelect Barcelona IMB CNM CSIC, Nano NEMS Grp,Campus UAB, Bellaterra 08193, Catalonia, Spain
[2] ICN2, Bellaterra 08193, Catalonia, Spain
来源
关键词
maskless lithography; focused ion beam; ion implantation; nanowire; mems; nanostructure; NANOMECHANICAL DEVICES; INDUCED DEPOSITION; SILICON; SPECTROMETRY; OSCILLATOR; RESOLUTION;
D O I
10.1117/1.JMM.14.3.031207
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A fast and flexible fabrication method that allows the creation of silicon structures of various geometries is presented. It is based on the combination of focused ion beam local gallium implantation, selective silicon etching, and diffusive boron doping. The structures obtained by this resistless method are electrically conductive. Freely suspended mechanical resonators of different dimensions and geometries have been fabricated and measured. The resulting devices present a good electrical conductivity which allows the characterization of their high-frequency mechanical response by electrical read-out. (C) 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
引用
收藏
页数:6
相关论文
共 50 条
  • [41] ALIGNMENT ACCURACY OF FOCUSED ION BEAM IMPLANTATION.
    Morita, Tetsuo
    Arimoto, Hiroshi
    Miyauchi, Eizo
    Hashimoto, Hisao
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes, 1987, 26 (06): : 955 - 958
  • [42] Combined method of focused ion beam milling and ion implantation techniques for the fabrication of high temperature superconductor Josephson junctions
    Chen, CH
    Jin, I
    Pai, SP
    Dong, ZW
    Sharma, RP
    Lobb, CJ
    Venkatesan, T
    Edinger, K
    Orloff, J
    Melngailis, J
    Zhang, Z
    Chu, WK
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (05): : 2898 - 2901
  • [43] Combined method of focused ion beam milling and ion implantation techniques for the fabrication of high temperature superconductor Josephson junctions
    Chen, C.-H.
    Jin, I.
    Pai, S.P.
    Dong, Z.W.
    Sharma, R.P.
    Lobb, C.J.
    Venkatesan, T.
    Edinger, K.
    Orloff, J.
    Melngailis, J.
    Zhang, Z.
    Chu, W.K.
    Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, 1998, 16 (05):
  • [44] Facile fabrication of ZnO nanowire-based UV sensors by focused ion beam micromachining and thermal oxidation
    Chao, Liang-Chiun
    Ye, Chi-Chao
    Chen, Yi-Pei
    Yu, Hua-Zhong
    APPLIED SURFACE SCIENCE, 2013, 282 : 384 - 389
  • [45] FABRICATION OF NANOSTRUCTURES IN STRAINED INGAAS/GAAS QUANTUM-WELLS BY FOCUSED-ION-BEAM IMPLANTATION
    ALLARD, LB
    AERS, GC
    CHARBONNEAU, S
    JACKMAN, TE
    WILLIAMS, RL
    TEMPLETON, IM
    BUCHANAN, M
    STEVANOVIC, D
    ALMEIDA, FJD
    JOURNAL OF APPLIED PHYSICS, 1992, 72 (02) : 422 - 428
  • [46] Praseodymium alloy ion source for focused ion beam implantation in superconductors
    Machalett, F
    Muhle, R
    REVIEW OF SCIENTIFIC INSTRUMENTS, 1996, 67 (03): : 1015 - 1017
  • [47] Key technologies of a focused ion beam system for single ion implantation
    Matsukawa, T
    Shinada, T
    Fukai, T
    Ohdomari, I
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (04): : 2479 - 2483
  • [48] Praseodymium alloy ion source for focused ion beam implantation in superconductors
    Machalett, F.
    Seidel, P.
    Muhle, R.
    Review of Scientific Instruments, 1996, 67 (3 pt 2):
  • [49] Key technologies of a focused ion beam system for single ion implantation
    Matsukawa, T.
    Shinada, T.
    Fukai, T.
    Ohdomari, I.
    Journal of Vacuum Science & Technology B: Microelectronics Processing and Phenomena, 1998, 16 (04):
  • [50] MASKLESS ION-IMPLANTATION OF CERIUM BY FOCUSED ION-BEAM
    KAGAMI, M
    SHIOKAWA, T
    SEGAWA, Y
    AOYAGI, Y
    NAMBA, S
    OKADA, H
    ITO, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1988, 27 (06): : L1157 - L1159