A Study of the Heat Transfer Characteristics of the Micro-channel Heat Sink

被引:0
|
作者
Wang, Shun [1 ]
Zhang, Yan [1 ]
Fu, Yifeng [2 ]
Liu, Johan [1 ,2 ]
Wang, Xiaojing [3 ]
Cheng, Zhaonian [1 ]
机构
[1] Shanghai Univ, Key Lab Adv Display & Syst Applicat, Minist Educ, SMIT Ctr,Sch Mechatron Engn & Automat, POB 282, Shanghai 200072, Peoples R China
[2] Chalmers Univ Technol, SMIT Ctr & Bionano Syst Lab, Dept Microtechnol & Nanosci, SE-41296 Gothenburg, Sweden
[3] Shanghai Univ, Sch Mechtron Engn & Automat, Shanghai 200072, Peoples R China
基金
中国国家自然科学基金; 美国国家科学基金会;
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Micro-channels are generally regarded as an effective method for the heat transfer in electronic products, and much effort has been put into improving their capacities. At the same time, carbon nanotubes have shown great potential in the field of heat transfer. This paper focuses on the microchannel heat sinks combined with carbon nanotubes. A series of 3D models had been created, and the heat transfer characteristics were studied. Two kinds of numerical model were carried out by using Fluent. One model contained the whole micro-channel cooler structure, and the other was a simplified model with only one channel taken into simulation. A comparison of results by the two models indicates a 19.5% variation in the maximum temperature on the fins. Furthermore, five micro-channel cooler structures were constructed with different fin widths. The simulation results showed that with the decrease in the fin width, heat transfer ability was improved. This is attributed to the anisotropic thermal conductivity of the fin arrays.
引用
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页码:179 / +
页数:2
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