Ag effect on microstructures and strength of SiC/SiC joint brazed with Cu-Ag-Ti filler metals

被引：3
|
作者：
Tamai, T [1 ]
Naka, M [1 ]
机构：
[1] OSAKA UNIV,WELDING RES INST,OSAKA 567,JAPAN
来源：
JOURNAL OF MATERIALS SCIENCE LETTERS | 1996年 / 15卷 / 12期
关键词：
D O I：
10.1007/BF00274896
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：1028 / 1029
页数：2
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