Integrated Millimeter-Wave Transceiver Concepts and Technologies for Wireless Multi-Gbps Communication

被引：0

作者：

Kissinger, D. ^{[1
,2
]}

Girg, T. ^{[3
]}

Beck, C. ^{[3
]}

Nasr, I. ^{[4
]}

Forstner, H. P. ^{[4
]}

Wojnowski, M. ^{[4
]}

Pressel, K. ^{[5
]}

Weigel, R. ^{[3
]}

机构：

[1] IHP, Technol Pk 25, D-15236 Frankfurt, Oder, Germany

[2] Tech Univ Berlin, D-10587 Berlin, Germany

[3] FAU Erlangen Nurnberg, Inst Elect Engn, D-91058 Erlangen, Germany

[4] Infineon Technol, D-85579 Neubiberg, Germany

[5] Infineon Technol, D-93049 Regensburg, Germany

来源：

2015 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2015年

关键词：

RECEIVER;

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

This paper provides an overview of millimeter-wave transceiver frontend concepts and realizations for wireless muIti-Gbps communication applications. Different state-of-the-art heterodyne and direct-conversion frontend implementations in silicon-germanium technology (SiGe) with their related applications are presented. These include highly compact embedded transceiver solutions featuring novel antenna-in-package concepts for low-cost short-range indoor 60 GHz broadband Wi-Fi/WLAN and WPAN access points. Furthermore, highly integrated multi-band transmitter and receiver chipsets in the 70/80 GHz E-Band as well as the complete 50-100 GHz frequency range for outdoor wireless backhaul point-to-point communication links and fixed local area network extension are outlined.

引用

页数：3

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