Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages

被引：0

作者：

Hu, Gojun ^{[1
,2
]}

Tay, Andrew A. O. ^{[2
]}

Zhang, Yongwei ^{[3
]}

Zhu, Wenhui ^{[4
]}

Chew, Spencer ^{[1
]}

机构：

[1] Cookson Semicond Packaging Mat, 12 Joo Koon Rd, Singapore 628975, Singapore

[2] Natl Univ Singapore, Dept Mech Engn, Nano Microsyst Integrat Lab, Singapore 117548, Singapore

[3] Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 117548, Singapore

[4] United Test & Assembly Ctr, Singapore, Singapore

来源：

EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2 | 2006年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Over the glass transition temperature, molding compounds strongly exhibit viscoelastic behavior which causes their Young"s moduli to be not only temperature-dependent but also time-dependent. In the present study, the stress relaxation test is used for the characterization of the viscoelasticity of an epoxy molding compound. The viscoelastic properties of the epoxy molding compound are determined in terms of Prony coefficients, relaxation time and time-temperature shift factors. Furthermore, the effect of viscoelasticity on the delamination in IC packaging is investigated.

引用

页码：53 / 59

页数：7

共 35 条

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