State-of-the art in vertical furnaces

被引：1
|
作者：
Hasper, A
Claasen-Vujcic, T
机构：
来源：
9TH INTERNATIONAL CONFERENCE ON ADVANCED THERMAL PROCESSING OF SEMICONDUCTORS - RTP 2001 | 2001年
关键词：
D O I：
10.1109/RTP.2001.1013747
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Batch furnaces would be by now replaced by the single wafer technology, this subject has been around in every generation change. The actual situation is quite different: batch furnaces are still holding a large market share, they still offer most cost effective solutions, they are competitive, innovative and backed up by investments in new developments. This paper will cover a selection of latest developments in diffusion/ LPCVD processing that have enabled this to happen.
引用
收藏
页码：78 / 81
页数：4
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