Mueller matrix imaging ellipsometry for nanostructure metrology

被引:53
|
作者
Liu, Shiyuan [1 ,2 ]
Du, Weichao [2 ]
Chen, Xiuguo [2 ]
Jiang, Hao [1 ]
Zhang, Chuanwei [1 ]
机构
[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
[2] Huazhong Univ Sci & Technol, Wuhan Natl Lab Optoelect, Wuhan 430074, Peoples R China
来源
OPTICS EXPRESS | 2015年 / 23卷 / 13期
基金
中国博士后科学基金; 中国国家自然科学基金;
关键词
CRITICAL DIMENSION; POLARIMETRY; FORMULATION; SILICON;
D O I
10.1364/OE.23.017316
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
In order to achieve effective process control, fast, inexpensive, nondestructive and reliable nanometer scale feature measurements are extremely useful in high-volume nanomanufacturing. Among the possible techniques, optical scatterometry is relatively ideal due to its high throughput, low cost, and minimal sample damage. However, this technique is inherently limited by the illumination spot size of the instrument and the low efficiency in construction of a map of the sample over a wide area. Aiming at these issues, we introduce conventional imaging techniques to optical scatterometry and combine them with Mueller matrix ellipsometry based scatterometry, which is expected to be a powerful tool for the measurement of nanostructures in future high-volume nanomanufacturing, and propose to apply Mueller matrix imaging ellipsometry (MMIE) for nanostructure metrology. Two kinds of nanostructures were measured using an in-house developed Mueller matrix imaging ellipsometer in this work. The experimental results demonstrate that we can achieve Mueller matrix measurement and analysis for nanostructures with pixel-sized illumination spots by using MMIE. We can also efficiently construct parameter maps of the nanostructures over a wide area with pixel-sized lateral resolution by performing parallel ellipsometric analysis for all the pixels of interest. (C) 2015 Optical Society of America
引用
收藏
页码:17316 / 17329
页数:14
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