Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die

被引：0
|
作者：
Peng, Weidong [1 ]
Wu, Zhiwei [1 ]
机构：
[1] Guangdong Coll Ind & Commerce, Guangzhou, Guangdong, Peoples R China
来源：
MECHATRONICS AND INTELLIGENT MATERIALS II, PTS 1-6 | 2012年 / 490-495卷
关键词：
Parallel bonding mechanism; Static stiffness; Stiffness matrix; Characteristic curves;
D O I：
10.4028/www.scientific.net/AMR.490-495.3531
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Based on the parallel bonding mechanism of IC chip die designed, the static stiffness model is established. Static stiffness characteristic curves are drawn in whole working place through Matlab software, the infection which created by the left/right driving parts and connecting rods are analyzed. It proves that the parallel bonding mechanism designed meets the working requirements of IC chip die by these characteristic curves.
引用
收藏
页码：3531 / 3535
页数：5
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