Computational design of thermo-mechanical metadevices using topology optimization

被引:18
|
作者
Hostos, Juan C. Alvarez [1 ,2 ]
Fachinotti, Victor D. [1 ]
Peralta, Ignacio [1 ,3 ]
机构
[1] Univ Nacl Litoral UNL, Ctr Invest Metodos Computac CIMEC, Consejo Nacl Invest Cient & Tecn CONICET, Predio CCT CONICET, Santa Fe, Argentina
[2] Univ Cent Venezuela, Dept Chem Met, Ciudad Univ, Caracas, Venezuela
[3] Univ Tecnolog Nacl UTN, Fac Reg Santa Fe FRSF, Lab Flujometria FLOW, Lavaise 610, RA-3000 Santa Fe, Argentina
基金
欧盟地平线“2020”;
关键词
Topology optimization; Metadevices; Thermo-mechanical; Cloaking; Sensitivity analysis; Design variables; NATURAL-CONVECTION; HEAT SINKS; REALIZATION; OPTIMALITY; REDUCTION; FATIGUE; DEVICES; SCALE;
D O I
10.1016/j.apm.2020.09.030
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The present work has been conducted in order to introduce a novel approach for the de-sign of mechanical devices conceived to manipulate the displacements field in linear elastic materials subjected to thermal gradients. Such an approach involves the solution of a topology optimization problem where the objective function defines the error in achieving a prescribed displacement field, and the mechanical device consists of two macroscopically distinguishable isotropic candidate materials. The material distribution is defined as a continuous function by following the solid isotropic microstructure (or material) with penalization (SIMP) method. The so-designed devices are easy to manufacture, since the design variables dictate the candidate materials distribution. Based on such an approach it is not necessary to devise further ways to simultaneously mimicking several thermal and mechanical effective properties, as required by coordinates transformation-based metamaterial design methods. Although the candidate materials are isotropic, the mechanical de-vice behaves as a metamaterial allowing the desired manipulation of the displacements field. As an example, this topology optimization-based approach is applied to the design of an elastostatic cloaking device subjected to thermal gradients, considering also thermodependent mechanical properties. (C) 2020 Elsevier Inc. All rights reserved.
引用
收藏
页码:758 / 776
页数:19
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