共 50 条
- [33] Formation of single phase Cu-Sn IMCs via layer-by-layer electroplating of Cu and Sn metals 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 980 - 984
- [34] DISORDER IN THE ORDERED BETA-BRASS PHASE OF THE SYSTEM CU-SN ZEITSCHRIFT FUR METALLKUNDE, 1982, 73 (12): : 798 - 803
- [35] Cu-Sn transient liquid phase wafer bonding for MEMS applications SMART SENSORS, ACTUATORS, AND MEMS VI, 2013, 8763
- [36] MECHANICAL CHARACTERIZATION OF TRANSIENT LIQUID PHASE SINTERED (TLPS) CU-SN PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2018, 2019,
- [37] Theoretical and Experimental Study of the Al – Cu – Si – Sn Phase Diagram in the Range of Aluminum Alloys Metal Science and Heat Treatment, 2016, 58 : 195 - 201