Low-cost packaging of semiconductor laser arrays

被引：3
|
作者：
Hunziker, W
机构：
来源：
IEEE CIRCUITS & DEVICES | 1997年 / 13卷 / 01期
关键词：
D O I：
10.1109/101.566168
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：19 / 25
页数：7
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