Device physics -: In search of low-k dielectrics

被引:323
|
作者
Miller, RD [1 ]
机构
[1] IBM Corp, Almaden Res Ctr, Div Res, San Jose, CA 95120 USA
关键词
D O I
10.1126/science.286.5439.421
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
引用
收藏
页码:421 / +
页数:2
相关论文
共 50 条
  • [31] Current and future low-k dielectrics for Cu interconnects
    Kikkawa, T
    [J]. INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 253 - 256
  • [32] Advanced materials for microelectronics:: ferroelectric and low-k dielectrics
    Fragalà, I
    [J]. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2002, 5 (2-3) : 63 - 63
  • [33] Process integration compatibility of low-k and ultra-low-k dielectrics
    Moore, D
    Carter, R
    Cui, H
    Burke, P
    McGrath, P
    Gu, SQ
    Gidley, D
    Peng, H
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2005, 23 (01): : 332 - 335
  • [34] Plasma etching for the application to low-k dielectrics devices
    Lee, J. W.
    Kim, H. W.
    Han, J. W.
    Kim, M. -S.
    Yoo, B. -D.
    Kim, M. -H.
    Lee, C. -H.
    Lee, C. H.
    Lim, C. H.
    Hwang, S. -K.
    Lee, C.
    Chung, D. J.
    Park, S. -G.
    Lee, S. G.
    O, B. H.
    Kim, J.
    Chang, S. P.
    Lee, S. H.
    Chai, S. -Y.
    Lee, W. I.
    Park, S. -E.
    Kim, K.
    Choi, D. -K.
    Chung, C. -W.
    [J]. RESEARCH TRENDS IN CONTEMPORARY MATERIALS SCIENCE, 2007, 555 : 113 - +
  • [35] Low-k dielectrics: Spin-on versus CVD
    [J]. Eur Semicond Design Prod Assem, 2 (13):
  • [36] Options for CVD of dielectrics include low-k materials
    Baliga, John
    [J]. Semiconductor International, 1998, 21 (06): : 139 - 140
  • [37] Transient Polymers for Low-k Dielectrics and Vaporizing Devices
    Kohl, Paul A.
    [J]. SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 7, 2017, 77 (05): : 165 - 170
  • [38] Low-k dielectrics featured at 1996 DUMIC conference
    不详
    [J]. INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 1996, 26 (02): : 133 - 133
  • [39] The Lucky Electron Model for TDDB in Low-k Dielectrics
    Lloyd, J. R.
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2016, 16 (04) : 452 - 454
  • [40] Expanding thermal plasma for low-k dielectrics deposition
    Creatore, M
    Barrell, Y
    Kessels, WMM
    van de Sanden, MCM
    [J]. MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2003, 2003, 766 : 339 - 344