Device physics -: In search of low-k dielectrics

被引：323
|
作者：
Miller, RD [1 ]
机构：
[1] IBM Corp, Almaden Res Ctr, Div Res, San Jose, CA 95120 USA
来源：
SCIENCE | 1999年 / 286卷 / 5439期
关键词：
D O I：
10.1126/science.286.5439.421
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
引用
收藏
页码：421 / +
页数：2
相关论文
共 50 条
  • [1] Nonporous low-k dielectrics
    Kumar, D
    [J]. SOLID STATE TECHNOLOGY, 2004, 47 (03) : 26 - 26
  • [2] The market for low-k interlayer dielectrics
    Chiang, SK
    Lassen, CL
    [J]. SOLID STATE TECHNOLOGY, 1999, 42 (10) : 42 - +
  • [3] Etch challenges of low-k dielectrics
    Morey, I
    Asthana, A
    [J]. SOLID STATE TECHNOLOGY, 1999, 42 (06) : 71 - +
  • [4] Reliability of low-k interconnect dielectrics
    Haase, Gaddi
    [J]. 2012 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP FINAL REPORT, 2012, : 35 - 35
  • [5] CMP processing with low-k dielectrics
    Fury, MA
    [J]. SOLID STATE TECHNOLOGY, 1999, 42 (07) : 87 - +
  • [6] Etch challenges of low-k dielectrics
    Lam Research Corp., Fremont, CA, United States
    不详
    [J]. Solid State Technol, 6 (71-78):
  • [7] Plasma etching of low-k dielectrics
    Thomas, Dave
    Powell, Kevin
    Song, Yiping
    Tossell, David
    [J]. European Semiconductor, 2000, 22 (05): : 30 - 31
  • [8] Plasma processing of low-k dielectrics
    Baklanov, Mikhail R.
    de Marneffe, Jean-Francois
    Shamiryan, Denis
    Urbanowicz, Adam M.
    Shi, Hualiang
    Rakhimova, Tatyana V.
    Huang, Huai
    Ho, Paul S.
    [J]. JOURNAL OF APPLIED PHYSICS, 2013, 113 (04)
  • [9] The case for nonporous low-k dielectrics
    Rantala, JT
    McLaughlin, W
    Reid, JS
    Beery, D
    Hacker, NP
    [J]. SOLID STATE TECHNOLOGY, 2003, 46 (12) : 34 - +
  • [10] Predicting the market in low-k dielectrics
    Corbett, M
    Davis, JC
    [J]. SOLID STATE TECHNOLOGY, 2000, 43 (04) : 38 - +
12345