Automatic macro inspection system

被引：8

作者：

Komatsu, K ^{[1
]}

Omori, T ^{[1
]}

Kitamura, T ^{[1
]}

Nakajima, Y ^{[1
]}

Aiyer, A ^{[1
]}

Suwa, K ^{[1
]}

机构：

[1] Nikon Corp, Sinagawa Ku, Tokyo, Japan

来源：

METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XIII, PTS 1 AND 2 | 1999年 / 3677卷

关键词：

inspection; wafer; macro inspection; defect; resist thickness;

D O I：

10.1117/12.350863

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Macroscopic defects on a wafer are caused by contamination, inhomogeneous resist-thickness, scratches etc. Many of these defects can be observed directly by human eyes rather than through a microscope. In many lithographic processes visual inspection by human operator is performed on all wafers; after the developing process. Tt is called a "macro inspection". However a macro inspection takes skill of detecting defects, because defects can be found under some conditions. We have been developing a new inspection system to replace operator-inspection with instrument-inspection for consistency in results. This system is constructed by a defect detecting technology and an image processing technology.

引用

页码：764 / 771

页数：8

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