Detection of Micro Defects in 3DIC Packages by Means of Non-Destructive 3D X-Ray

In semiconductor assembly, destructive cross-section observation is the mainstream of defects analysis method, the issues that are making destructive analytical methods to be changed are more tedious and time consuming, because it might cause higher risk of creating artifacts. Nevertheless, advanced 3D x-ray technology enables to substitute the destructive analysis and provides the non-destructive detection of defects in 3DIC packages. The key challenge in its general operation principle is data acquisition time. This paper reviews the x-ray computed tomography method (CT scan) for non-destructive micro defects in 3DIC packages. The results have proved that 2D x-ray imaging capabilities is limited and the comparison in 3D x-ray operation principle between microscope and projection based imaging capabilities at micrometer resolution is practiced as a fine method to possibly observe defect shape, size and distribution by conducting the virtual cross-section at desired location. Based on the provided details of defect analysis, 3D x-ray works as a good method to provide non-destructive detect for 3DIC package applications.